Description
ASRock H370M-HDV Motherboard & Intel Core i5-9500 Processor (Tray) Bundle
ASRock H310CM-HDV Motherboard is compatible with 9th and 8th Gen Intel Core Processors (Socket 1151). It supports DDR4 2666. Graphics Output Options are DVI-D, D-Sub, HDMI. 7.1 CH HD Audio (Realtek ALC887 Audio Codec), ELNA Audio Caps. 4 SATA3. 4 USB 3.1 Gen1 (2 Front, 2 Rear). It has Full Spike Protection. This motherboard has a High-Density Glass Fabric PCB design which lessens the density of the gap in between the PCB layers to protect the motherboard from the short circuits happening because of humidity. Sapphire Black PCB makes it eye-catching. It has been used for the safety and durability of the motherboard. ASRock H370M-HDV Motherboard has 4 x USB3.2 onboard which can deliver data transfer 10x faster than USB 2.0. USB 3.2 Gen1 technology has upgraded the data transfer rate up to 5GB/s. ASRock H370M-HDV Motherboard has all three types of most used graphics output connectors. It supports D-Sub, DVI-D, HDMI combo. It also has an HDMI port which supports 4k resolution. It may need the help of integrated graphics though. With that, it will deliver the most stunning graphic quality. It comes with a 10bit HEVC Decoding/Encoding which provides better video quality and a higher bit depth video experience.
The Intel Core i5-9500 Processor comes with Intel UHD Graphics 630 graphics. This 9th gen Coffee Lake microarchitecture is manufactured with the 14nm process that comes with six cores but lacks HyperThreading. As this chip is updated to the latest BIOS revision, it nicely fits into any Intel 300-series motherboard. Focusing on this, all the major motherboard manufacturers have already started BIOS updates for their 300-series lineup. This Processors also support 64-bit computing on Intel architecture requires an Intel 64 architecture-enabled BIOS. Intel 9th Generation Core i5-9500 Processor has a base frequency of 3.00 GHz that can be reached as max turbo frequency at 4.40 GHz. It has a SmartCache of 9 MB containing 6 cores and 6 threads. With a bus speed of 8 GT/s, it has thermal design power (TDP) rating of 65W. This latest microchip has few expansion options such as 3.0 PCI express revision having configured up to 1×16, 2×8, 1×8+2×4, and a maximum of 16 lanes. Considering the memory this processor has a dual-channel of max 128GB of the size that supports up to DDR4-2666 bus speed.
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